http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08301909-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f71ddd387b22b19ebcea454e62d66128 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-22 |
| filingDate | 1995-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6a293ea5fbe056692c452dae47c8067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab37271916a893c5f4a6131804b85320 |
| publicationDate | 1996-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08301909-A |
| titleOfInvention | Flux bleeding inhibitor for soldering |
| abstract | (57) [Summary] [Structure] Component A: (meth) acrylic acid ester having 4 to 22 carbon atoms, and (meth) acrylic acid ester and / or (meth) acrylic acid having a reactive functional group, Component B: saturated ester having a reactive functional group having a C4-21 polyfluoroalkyl group or polyfluoroether group, C component: a C4-21 polyfluoroalkyl group or polyfluoroether group Less than 50% by weight of unsaturated ester having a component D: crosslinker 15 A solder bleeding preventive agent, which is a copolymer composed of not more than 10% by weight (provided that the total of the above components is 100% by weight) and is dissolved and dispersed in an organic solvent. It is preferable that the component A further contains a macromonomer. [Effect] The anti-bleeding agent does not absorb moisture even after a long time has passed after soldering, so it does not lower the insulation resistance of the printed circuit board, and it does not peel off even if the coated part is touched or rubbed a little. Therefore, the bleeding preventive agent adheres to the entire surface of the printed circuit board during soldering. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5295131-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009090798-A1 |
| priorityDate | 1995-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.