| abstract |
(57) [Summary] [PROBLEMS] To provide a photosensitive resin composition having good workability, flexibility and excellent solder heat resistance, and a photosensitive film using the same. [Structure] (a) Obtained by reacting a hydroxyl group-containing ethylenically unsaturated compound with a urethane compound having isocyanate groups at both ends, which is obtained by reacting a polycarbonate compound having hydroxyl groups at both ends with a diisocyanate compound. An ethylenically unsaturated group-containing polymerizable compound containing an ethylenically unsaturated group-containing urethane compound, (b) a thermoplastic polymer having a carboxyl group, and (c) a photopolymerization initiator that generates free radicals by active light. A photosensitive resin composition which can be developed with an alkaline aqueous solution and a photosensitive film using the same. |