http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08286373-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 1995-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1cb5860c4d4a2a1fc2e82beba7cdd60 |
| publicationDate | 1996-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08286373-A |
| titleOfInvention | Photosensitive resin composition |
| abstract | (57) [Summary] [Structure] The present invention provides (A) (a) carboxylic acid and (b) In the polyamic acid resin molecular chain consisting of a diamine compound, a polyamic acid resin containing at least one structural unit represented by the following general formula and (However, in the formula, R 1 represents a divalent organic group, R 2 represents an alkylene group or a phenylene group, and n represents an integer of 1 or more.) (B) A photosensitive aromatic halonium salt must be an essential component. Is a photosensitive resin composition. [Effect] The photosensitive resin composition of the present invention has an extremely high sensitivity, excellent storage stability and heat resistance, and is suitable as an insulating layer or a passivation layer of a solid element. |
| priorityDate | 1995-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 182.