| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
1995-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c80e55354f4fbee84a3d9c3f49394ba3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19218a83f95ab9b1567f1ed1090142fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09f3011f57aedd39ebe9729db5b35296 |
| publicationDate |
1996-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08283382-A |
| titleOfInvention |
Epoxy resin composition for printed wiring board |
| abstract |
(57) [Abstract] [Purpose] To improve the adhesiveness to copper foil and the electrolytic corrosion resistance of a composition obtained by mixing a phenol-added conjugated diene polymer with an epoxy resin for laminates. [Structure] Epoxy resin for laminated plate, (a) phenol-added conjugated diene polymer, (b) urea or urea derivative, (c) curing accelerator and (d) hindered phenolic antioxidant, benzene ring Further, one or more kinds of antioxidants selected from a compound type antioxidant having three or more hydroxyl groups, a sulfur compound type antioxidant and a phosphorus compound type antioxidant are blended. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008516064-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0870805-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6180250-B1 |
| priorityDate |
1995-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |