http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0827267-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5198a2a21392d6cbc0bb4898b3fb3d29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D493-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 |
| filingDate | 1994-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84fc978b978107ac1204c73c5dec294d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8157798227d0a0ca5817ca0981e0c49c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dd4fd86687179daad07ce95eb36b387 |
| publicationDate | 1996-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0827267-A |
| titleOfInvention | Novel orthospiroester compound, resin composition and cured product |
| abstract | (57) [Summary] [Object] To provide a novel orthospiroester compound having excellent heat resistance and a large volume expansion coefficient upon curing. Further, the present invention provides a low-curing shrinkable resin composition containing the novel orthospiroester compound and having excellent heat resistance, and a cured product thereof. [Structure] The following general formula (1): (However, A in the formula is (Wherein R represents hydrogen or a lower alkyl group), m represents an integer of 0 to 10, and q represents an integer of 2 to 10). . Further, when a curing agent, an epoxy resin or the like is added to this orthospiroester compound, a low curing shrinkable resin composition is obtained, and when this is cured, a cured product is obtained. [Effect] Since this orthospiroester compound has a large volume expansion during curing, it becomes possible to prepare a low-curing shrinkable resin composition having a small volume contraction during curing as a whole. Therefore, it is possible to reduce the internal stress of the cured product that occurs due to the volume shrinkage during curing, and it is useful for applications such as molding materials, sealing materials, and adhesives that require dimensional accuracy. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021014544-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4972851-B2 |
| priorityDate | 1994-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.