http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0827251-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f548ca15b9b5748f1afd80e3d1636ec |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 1994-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5d4ca4459cb5f2c8c8922c07feb23a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d07805b03adcdbc9a01781d3113d23b |
| publicationDate | 1996-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0827251-A |
| titleOfInvention | Epoxy resin composition and semiconductor encapsulation device |
| abstract | (57) [Summary] [Structure] The present invention provides (A) a biphenyl-type epoxy resin represented by the following formula: (B) Phenolic resin, (C) Silane coupling agent having an epoxy group represented by the following general formula, to which an extremely small amount of organic base is added, R 1 -C n H 2n -Si (OR 2 ) 3 (D) A spherical alumina powder having a maximum particle size of 100 μm or less and (E) a curing accelerator are essential components, and the spherical alumina powder (D) is contained in a proportion of 25 to 90% by weight with respect to the resin composition. An epoxy resin composition, and a semiconductor encapsulation device in which a semiconductor chip is encapsulated with a cured product of the epoxy resin composition. [Effect] The epoxy resin composition and the semiconductor encapsulation device of the present invention are excellent in moisture resistance, solder heat resistance, moldability, filling property, and thermal conductivity, are less affected by moisture absorption, have good heat dissipation properties, and have a long life. Reliability can be guaranteed over a period of time. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9703129-A1 |
| priorityDate | 1994-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.