http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0827250-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 1994-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e79c817c087080aad6668b35b2dd8900 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b280d12b47fcbcbafa354dd7a30f84c |
| publicationDate | 1996-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0827250-A |
| titleOfInvention | Epoxy resin composition and semiconductor sealing material |
| abstract | (57) [Summary] [Structure] Epoxidized products of polyadducts of phenols and polycyclic aliphatic hydrocarbons such as dicyclopentadiene and tetrahydroindene, and phenols such as BPA novolak resin are methylene as a curing agent. An epoxy resin composition containing as an essential component a polyphenol bound by both a base and an alkylidene group. Also, a semiconductor encapsulating material obtained by further mixing an inorganic filler. [Effect] The epoxy resin composition of the present invention is excellent in heat resistance, has a low elastic modulus in a high temperature range (210 to 260 ° C), and has excellent physical properties when heated. Further, it is extremely excellent in solder crack resistance as a semiconductor sealing material. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001064358-A |
| priorityDate | 1994-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 117.