abstract |
(57) [Summary] [Structure] A crystalline epoxy resin having a melting point of 50 to 150 ° C., An epoxy resin composition for semiconductor encapsulation, comprising a phenol resin curing agent, a curing accelerator represented by the following formula, and an inorganic filler as essential components, and containing 75 to 93% by weight of the inorganic filler in the entire composition. Embedded image [Effect] It has excellent room temperature storage characteristics, can greatly improve the curing characteristics during molding, and has excellent solder crack resistance, which can greatly improve productivity. |