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filingDate 1995-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08269167-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation
abstract (57) [Summary] [Structure] A crystalline epoxy resin having a melting point of 50 to 150 ° C., An epoxy resin composition for semiconductor encapsulation, comprising a phenol resin curing agent, a curing accelerator represented by the following formula, and an inorganic filler as essential components, and containing 75 to 93% by weight of the inorganic filler in the entire composition. Embedded image [Effect] It has excellent room temperature storage characteristics, can greatly improve the curing characteristics during molding, and has excellent solder crack resistance, which can greatly improve productivity.
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