| abstract |
(57) [Summary] [Structure] Aluminum nitride powder in which an aluminum oxide layer and a silicon oxide layer are provided on the surface of aluminum nitride powder, and aluminum nitride powder in which the surface of this aluminum nitride powder is further surface-treated with an organic silicon compound. . [Effects] The aluminum nitride powder of the present invention has excellent moisture resistance and thermal conductivity, and can impart carbon functional characteristics to the surface thereof, so that it can be used as a filler for various composite materials, especially for semiconductor encapsulation. It is effective as a filler for resin compositions. |