http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08262465-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1343
filingDate 1995-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b137ab57fb4520d8359dcd1910452c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6277b0579623531cae93a071c446758c
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publicationDate 1996-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08262465-A
titleOfInvention Method for forming transparent conductive pattern
abstract (57) [Abstract] [Purpose] A mask is formed by printing without using etching technology or a metal mask, and water is used to remove the mask. Provided is a method for producing a transparent conductive pattern, which has a high yield and is easy to increase in size. [Structure] Ink printed with water or a liquid containing water as a main component by subjecting a hydrophilic ink to letterpress printing on a portion of a substrate other than that requiring a transparent conductive film, forming a transparent conductive film after drying. And an unnecessary transparent conductive film is removed to manufacture a transparent conductive pattern.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8064034-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020015012-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017517469-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100652214-B1
priorityDate 1995-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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