| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
1995-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93058b3b5fe1293015865fa09e24219e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_178f832fd3d7a120fde0135ffe7e1b76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2d3415f7cdd11faeb15e16215f5f79e |
| publicationDate |
1996-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08259665-A |
| titleOfInvention |
Epoxy resin curing agent and method for producing the same |
| abstract |
(57) [Summary] [Structure] A specific structure obtained by adding and / or condensing a compound having at least two ethylenically unsaturated bonds and a formaldehyde supply compound to an aromatic hydrocarbon having a phenolic hydroxyl group. The present invention relates to an epoxy resin curing agent composed of a phenol resin and a method for producing the same. [Effect] The epoxy resin curing agent of the present invention has good performance. Further, the epoxy resin composition is excellent in heat resistance and low water absorption, and is particularly useful for electric and electronic materials. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20100127258-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002249546-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010248407-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010024642-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009110453-A1 |
| priorityDate |
1995-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |