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filingDate 1995-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7f715073931c42bf7975b61870ca6f7
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publicationDate 1996-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08250437-A
titleOfInvention Metalorganic vapor phase growth method
abstract (57) [Summary] [Object] To provide a metalorganic vapor phase epitaxy method capable of forming a steep hetero interface in the production of InGaAsP multilayer structures having different compositions. [Structure] After the growth of the InGaAsP well layer, it is waited in the group V AsH 3 and PH 3 having the well composition, and then in the group V gas having TBP before the growth of the InGaAsP barrier layer having a smaller As composition than the well layer (waiting for TBP). Process) After that, a barrier layer is grown. [Effect] TBP has a decomposition temperature of about 100 ° C compared to PH 3. Since the phosphorus pressure is 5 times or more higher at the same low growth temperature and the same V / III ratio, desorption of arsenic adhering to the inside of the growth furnace and group V atoms at the growth interface can be suppressed by the high phosphorus pressure. Therefore, InG In the aAsP multi-layer film growth, TB was used in the group V standby process before the growth of the InGaAsP layer having a smaller arsenic composition than the previous layer. By using P, it is possible to suppress the residual or desorption of arsenic at the interface and realize a steep hetero interface.
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