| abstract |
(57) Abstract: A resin composition which provides a resin-encapsulated semiconductor device excellent in solder heat resistance, flame retardancy and high temperature reliability. An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, a bromine compound, and an antimony compound, wherein the curing agent has a structure of the following formulas (I) (II) (III) at the same time. An epoxy resin composition for semiconductor encapsulation, which contains 87 to 95% by weight of the entire composition, and the bromine compound and the antimony compound are 0.3% by weight or less of the entire composition. And a resin-encapsulated semiconductor device encapsulated with the epoxy resin composition. Embedded image |