| abstract |
(57) Abstract: [PROBLEMS] To provide a technique and a composition capable of improving soldered adhesion while minimizing reduction of conductor solderability. SOLUTION: (A) Finely pulverized metal conductor phase 50-90 % By weight, (B) 1 to 18% by weight of inorganic binder phase, (C) General formula [Ma 1+ ] x [Mb 2+ ] 1-x Al 2-x Si 2 + x O 8 Where Ma is selected from the group consisting of K and Na, Mb Is Ca and x is an adhesion promoter in which 0 to 1 is 0.01 to 3.0% by weight, all of (A), (B) and (C) containing a base paste dispersed in an organic medium. |