| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_229fd6f7a62130a11fcb15a6e5ec8e77 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13 |
| filingDate |
1995-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90056d809d9b2d9199b34d26d6965e4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3860b9757f1694ca4b66c020a2ba4659 |
| publicationDate |
1996-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08239508-A |
| titleOfInvention |
Heat resistant resin composition |
| abstract |
(57) [Abstract] [Purpose] To improve the moldability (fluidity) of heat-resistant thermoplastic resin without lowering the heat resistance and mechanical properties. [Composition] Heat-resistant thermoplastic resin and melting point 150-350 ℃ A heat-resistant resin composition containing the bisphenol compound. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007116967-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011021083-A |
| priorityDate |
1995-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |