http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08236907-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-00 |
| filingDate | 1995-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efbb5e7d636e018590bfad21623c145a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28d76e965a8f6f26315e982e6beffc8b |
| publicationDate | 1996-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08236907-A |
| titleOfInvention | High density circuit board |
| abstract | (57) [Summary] [Purpose] A high-strength poly-phenylene ether resin composition whose inter-line insulating material retains the excellent dielectric properties of polyphenylene ether and exhibits excellent chemical resistance and heat resistance even after curing. A density circuit board is provided. [Structure] (a) a reaction product of a polyphenylene ether resin and an unsaturated carboxylic acid or an acid anhydride, (b) triallyl isocyanurate and / or triallyl cyanurate, and (c) the following general formula (1) A high-density circuit board made of a line insulation material containing the specified flame retardant. Embedded image |
| priorityDate | 1995-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.