| abstract |
(57) [Summary] [Structure] The inkjet head H formed on the substrate 1. In the wiring forming method for forming wiring for electrically connecting an electronic component element such as the like to the outside on the substrate 1, a concave groove 9 is formed on the surface of the substrate 1, and a first groove 9 is formed in the groove 9. After forming the wiring layer, a second wiring layer for connecting the first wiring layer to the electronic component element is provided along the surface of the substrate 1. [Effect] Even if the area occupied by the first wiring layer on the substrate surface is small, it is possible to increase the cross-sectional area according to the depth of the groove 9 and reduce the resistance. As a result, even if the area occupied by the entire wiring layer on the substrate surface is reduced and the height dimension of the second wiring layer is reduced, the wiring resistance of the entire wiring layer can be further reduced. The workability / productivity in the assembly in the subsequent process in, etc. is improved. |