| abstract |
(57) [Summary] [Objective] To provide a manufacturing method of a known good die in which a solder bump can be previously formed on a bonding pad of a die from a stage of a wafer process. A step of forming a plurality of identical circuit patterns on a wafer 10 and a bonding pad 12 for external connection of each circuit pattern, a step of forming a solder bump 14 on the bonding pad, and a step of forming a solder bump A step of forming a metal layer 16 for wire bonding on the substrate, a step of cutting the wafer into dies 28 for each circuit pattern unit after the formation of the metal layer, and a step of holding the cut die in a test die holder 20. , A step of wire bonding between the circuit connection terminal of the die holder and the held metal layer 16 of the die, a step of thereafter testing the die, and a step of removing the metal layer and the wire of the die after the test step to form the solder bump 14. Obtaining a known good die. |