| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
1995-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9abfe401b399960849ae8e10c612c10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1162b102e5d140944a4a63e2f15b96a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ce3eeb15dac8588f4ea532b6a93f5c7 |
| publicationDate |
1996-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08230106-A |
| titleOfInvention |
Method for manufacturing copper clad laminate |
| abstract |
(57) [Summary] [Purpose] The reliability of through-hole connection is improved by preventing the formation of minute voids in the silver- or copper-paste through-hole connection. [Structure] Resin is impregnated and adhered to a paper base material, and the resin is semi-cured by heating and the volatile content is 0.5 to 2.0% by weight. The copper foil is placed on the laminated body in which the prepregs obtained in step 1 above are overlapped and heated and pressed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-03009660-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009109003-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7059044-B2 |
| priorityDate |
1995-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |