http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08227612-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_888a5eedd5b015d2a11fc86778ef6136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b27deaf45890893586c2ed77ac13dc32 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-16 |
filingDate | 1995-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9f26dc1bfe39399453836fc1394b900 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa4adc7cb4a4476c70cfabc76e1c92a4 |
publicationDate | 1996-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-H08227612-A |
titleOfInvention | Conductor paste composition |
abstract | (57) [Summary] [Construction] A conductor paste composition containing, as conductive particles, Cu powder consisting of Cu particles obtained by rapid solidification. [Effect] By using this conductor paste to form a conductor paste layer on a substrate such as a ceramics substrate, and performing a drying process and a firing process, a dense Cu conductor layer that does not include openings is formed on the substrate. Can be formed. Therefore, Even if the conductor layer on the substrate formed by this method is subjected to the plating pretreatment or the plating treatment, the plating pretreatment liquid or the plating treatment liquid penetrates into the inside of the conductor layer, and the boundary portion between the conductor layer and the ceramic substrate is formed. It is possible to maintain the adhesive strength between the conductor layer and the ceramic substrate without corroding the glass layer and the like formed on the substrate. |
priorityDate | 1995-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.