http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08225632-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 1995-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a248e9ac1fda821c61ad943941740c5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8e8597b3499db68a000482a47314c52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d70ab8ad20ce2e3455ea786b12c6e3f6 |
| publicationDate | 1996-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08225632-A |
| titleOfInvention | Epoxy resin composition for encapsulation and semiconductor device using the same |
| abstract | (57) [Abstract] [Purpose] Epoxy resin composition for encapsulation, which can obtain a semiconductor device having a low moisture absorption rate and good moisture absorption solder crack resistance and moisture resistance reliability, and moisture absorption solder crack resistance using the composition. And a semiconductor device having improved moisture resistance reliability. [Structure] In a sealing epoxy resin composition obtained by adding a curing agent, an inorganic filler and a curing accelerator to an epoxy resin, the epoxy resin having a dicyclopentadiene skeleton is added in an amount of 20 to 100 relative to the total amount of the epoxy resin. 2% by weight of phenolic resin curing agent based on the total amount of curing agent 0 to 100% by weight, and 10 to 50% by weight of the inorganic filler having a particle diameter of 5 μm or less based on the total amount of the inorganic filler. 20 to 100% by weight of spherical inorganic filler. It also contains an ion scavenger. In addition, the semiconductor device A semiconductor element is sealed using the above-mentioned sealing epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111040378-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111040378-A |
| priorityDate | 1995-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.