| abstract |
(57) [Abstract] [PROBLEMS] To provide a method of using a pressure-sensitive adhesive tape for protecting the surface of a semiconductor wafer, which enables easy peeling without damaging the semiconductor wafer. [Structure] An adhesive layer provided on the surface of a release film having a surface tension of less than 35 dyne / cm and a Vicat softening point of 100 ° C. or more has a surface tension of 35 dyne / cm or more and a shrinkage rate at 25 ° C. of 5%. Less than and 5 A pressure-sensitive adhesive tape for protecting a semiconductor wafer surface obtained by transferring to a surface of an ethylene-vinyl acetate copolymer stretched film having a shrinkage rate of 5 to 50% when immersed in warm water of 0 to 80 ° C. A method for using a pressure-sensitive adhesive tape for protecting the surface of a semiconductor wafer, which comprises sticking to the front surface of a semiconductor wafer via an agent layer, grinding the back surface of the semiconductor wafer, and immersing in hot water at 50 to 80 ° C. to peel off. |