http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08213517-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_efbfdc7316d3b1b7ceaee5366a61b6e0 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L31-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 |
| filingDate | 1995-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f306669b612dff5943d5dd718881cc08 |
| publicationDate | 1996-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08213517-A |
| titleOfInvention | Electronic circuit sealing composition and electronic circuit sealing method |
| abstract | (57) [Summary] [Object] The present invention tightly seals an electronic circuit, and protects the above-mentioned element from various environmental conditions, in particular, thermal expansion and contraction due to shock, fluctuation cycle of temperature, and intrusion of moisture. Thus, the present invention provides a composition for encapsulating an electronic circuit and a method for encapsulating an electronic circuit, which enables stable use thereof. The present invention relates to an electronic circuit encapsulating composition obtained by mixing an ethylene-vinyl acetate copolymer with a silane coupling agent and an organic peroxide or a photosensitizer, and the electronic circuit encapsulating composition. An electronic circuit is sandwiched between molding materials consisting of The present invention relates to a method for sealing an electronic circuit, which comprises degassing under reduced pressure and heating, and then cross-linking the molding material by heating or light irradiation to perform sealing without bubbles or air bubbles. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013035869-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9334429-B2 |
| priorityDate | 1995-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 84.