| abstract |
(57) [Summary] [Structure] A. An epoxy group-containing polymer obtained by polymerizing 40 to 100 mol% of an ethylenically unsaturated monomer having only one epoxy group in the molecule and 0 to 60 mol% of another ethylenically unsaturated monomer, B. A photopolymerization initiator, C.I. Diluent and D.I. A photo-solder resist ink developable with a dilute alkaline solution, which comprises a photosensitive resin having a carboxyl group and a photopolymerizable ethylenically unsaturated group and capable of being dissolved or dispersed in the dilute alkaline solution. [Effect] The development width is wide during use, the substrate can be stored for a long time after pre-curing, and it has excellent resolution, sensitivity, and solder resistance. When it is used in the manufacture of printed circuit boards, The solder resist formed above has excellent substrate adhesion, chemical resistance, gold plating resistance and electrical characteristics, and particularly excellent solder heat resistance and electrolytic corrosion resistance. |