http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08211608-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 1995-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55ddee279dfc822afe147a87c20d6b93 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50a91c9eeddb59455ae0a4466ebec98 |
| publicationDate | 1996-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08211608-A |
| titleOfInvention | Resin composition, permanent resist resin composition and cured products thereof |
| abstract | (57) [Summary] [Structure] The present invention comprises the following components (a), (b) and (c): And (d) a resin composition, and a permanent resist resin composition for a printed wiring board. (A) A polyfunctional epoxy resin having an epoxy equivalent of 120 to 500, (b) a phenol novolak having at least one acryloyl group or a methacryloyl group, (c) a photopolymerizable and heat-reactive monomer such as glycidyl acrylate and glycidyl methacrylate. Diluent, and (d) photopolymerization initiator. [Effect] Despite high resolution and easy development with an aqueous alkaline solution, solvent resistance to isopropyl alcohol, trichlorethylene, methylene chloride, acetone, etc. Excellent resistance to plating solution against plating, Furthermore, it is possible to manufacture a printed wiring board having heat resistance that can withstand a temperature of about 260 ° C. during the soldering process. |
| priorityDate | 1995-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 84.