| abstract |
(57) [Abstract] [Purpose] The conditions such as low dielectric constant, low dielectric loss tangent, and high heat resistance that can withstand solder reflow that can be continuously formed by extrusion molding and are essential for high frequency compatible electric circuit board materials. Provided is an extruded sheet material which is extremely suitable as a practicable thermoplastic resin substrate, and its use. [Structure] A polyester having 85 mol% or more of 1,4-cyclohexanedimethylene terephthalate-based repeating units and a reinforcing fiber containing a metal silicate-based fibrous material and / or a metal borate-based fibrous material as a main component. An extrusion-molded sheet-like product produced by extrusion-molding, which comprises 5 to 60% by weight based on the total weight of the polyester and the fibrous product, and an electric circuit board obtained therefrom. |