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filingDate 1995-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08197414-A
titleOfInvention Chemical / mechanical polishing slurry for metal layers
abstract (57) Abstract: A chemical / mechanical polishing slurry for metal layer is provided. SOLUTION: About 40 m uniformly dispersed in an aqueous medium. And a surface area in the range of 2 / g~ about 430m 2 / g, about 1.0 Repulsive to an aggregate size distribution of less than μ, an average aggregate diameter of less than about 0.4μ, and van der Waals forces between particles, A chemical / mechanical polishing slurry for metal layers, which contains high-purity metal oxide fine particles and is colloidally stable, which has sufficient force to overcome this.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001118815-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000311874-A
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