http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08194012-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12d24c0a12c3ecdb6d9a47d623d96e76 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate | 1995-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e24e77adf96f0beefd07e228895354f |
| publicationDate | 1996-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08194012-A |
| titleOfInvention | Semiconductor element characteristic measuring device |
| abstract | (57) [Abstract] [Purpose] To reduce the contact resistance when measuring the characteristics by contacting the terminal electrodes on the wafer surface of the electrodes on the stage, Reduce the error in the characteristic value. [Structure] The electrodes on the stage are made of conductive fiber, conductive resin, Even if the wafer is warped, uniform contact resistance can be obtained by forming the conductive rubber so as to have flexibility and making the measuring needle stand on the surface of the wafer and easily deforming when pressed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8471585-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006337247-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011174946-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105527319-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016076662-A |
| priorityDate | 1995-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 |
Total number of triples: 19.