http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08193267-A

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filingDate 1995-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baf6791a0fbd6e0a717babf66b2eca16
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publicationDate 1996-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08193267-A
titleOfInvention Metal thin film deposition method
abstract (57) [Summary] [Structure] In the process of forming a metal thin film on a semiconductor surface having a fine structure with a high aspect ratio by using a metal halide such as titanium tetrachloride, vibrationally excited hydrogen molecules are used as a reaction surface. The chlorine atoms bonded to titanium or the like are eliminated as hydrogen chloride molecules, the surface reaction proceeds at a low temperature, and the residual concentration of chlorine that causes corrosion is reduced. [Effect] It is possible to form a uniform and good-quality metal thin film on a semiconductor surface having a fine structure with a high aspect ratio under a condition of lower temperature than conventional.
priorityDate 1995-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.