http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08186058-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-10
filingDate 1995-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_254f7623fcc6f336c95a9095e51be0e8
publicationDate 1996-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08186058-A
titleOfInvention Manufacturing method of multilayer capacitor
abstract (57) [Abstract] [Purpose] It is possible to fabricate a multilayer capacitor with a thinner dielectric layer than conventional ones and to obtain a larger capacitance, and to integrate the dielectric and internal electrode laminate at a low firing temperature. (EN) Provided is a technically and economically excellent method of manufacturing a multilayer capacitor which can be sintered and can use a base metal for an internal electrode. [Structure] A solution of an organometallic compound is applied to both surfaces of a first metal thin piece to be an internal electrode, and then dried to form a dielectric layer, and a dielectric layer and a first metal thin piece serving as a counter electrode are formed. Two The metal flakes are alternately stacked and fired at 300 ° C. or higher to integrally sinter the metal oxide dielectric and the internal electrodes. Also, A base metal can be used for the metal flakes.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6372034-B1
priorityDate 1995-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 20.