| abstract |
(57) [Summary] [Purpose] It is possible to suppress the amount of through-hole etchback and the amount of penetration of the plating film into the glass cloth layer of the substrate, and improve the adhesion to the plating film and solder heat resistance. Provide an adhesive for additive plating that can roughen MnO 4 . [Structure] (a) Bisphenol A in which isocyanatoethyl methacrylate is added to 20 to 100% of secondary hydroxyl groups Type epoxy resin, (b) novolac type epoxy resin in which acrylic acid is added to 20 to 70% of epoxy groups, (c) Acrylonitrile-butadiene rubber to which acrylic acid or methacrylic acid is added, (d) a resole-type phenol resin, (e) a photopolymerization initiator, and (f) an adhesive for additive plating containing a thermosetting agent as a main component. |