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filingDate 1994-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0817873-A
titleOfInvention Wire bonding device, bonding tool and bonding arm to be equipped with the device
abstract (57) [Abstract] [Purpose] To provide a wire bonding apparatus, a bonding tool, and a bonding arm that achieve an increase in the transmission efficiency of ultrasonic energy to a bonding tool and realize this at low cost. [Structure] A member 37 made of a material having a large deformation ratio is interposed between a mutual joining portion of a horn 1 forming a part of a bonding arm and a capillary (bonding tool) 4 mounted on the horn 1, and the above It has an effect.
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