http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08176280-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
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filingDate 1994-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c09ddd536da8960210b8070cde840760
publicationDate 1996-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08176280-A
titleOfInvention Liquid epoxy resin composition and method for producing the same
abstract (57) [Abstract] [Purpose] Suitable for forming a resin encapsulation layer by spot encapsulation, giving it flexibility and increasing the adhesive strength to a flexible wiring board made of a polyimide film. Provided is a long liquid epoxy resin composition and a method for producing the same. In a one-part liquid epoxy resin composition containing a liquid epoxy resin, a curing agent, a curing accelerator, a flexibility-imparting agent and a filler, the curing agent comprises an allylated phenol novolac and an acid anhydride. The content of the acid anhydride is 5 to 35% by weight based on the total amount of the curing agent, and the curing accelerator is triphenylphosphine coated with microcapsules having an elution temperature of 100 to 150 ° C. After mixing and kneading a part of the liquid epoxy resin, the curing agent, the flexibility-imparting agent and the filler, a mixture of the triphenylphosphine coated with the microcapsules and the remaining liquid epoxy resin is added, Mix and knead.
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priorityDate 1994-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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