http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08176276-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 1995-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a248e9ac1fda821c61ad943941740c5d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d70ab8ad20ce2e3455ea786b12c6e3f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8e8597b3499db68a000482a47314c52 |
| publicationDate | 1996-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08176276-A |
| titleOfInvention | Epoxy resin composition for encapsulation and semiconductor device using the same |
| abstract | (57) [Abstract] [PROBLEMS] To provide an encapsulating epoxy resin composition having improved fluidity and moisture resistance reliability after soldering, and a semiconductor device using the encapsulating epoxy resin composition. [Structure] The epoxy resin composition for encapsulation comprises an epoxy resin, a curing agent, and an inorganic powder filler, the epoxy resin contains the epoxy resin of the following formula, and the inorganic powder filler has the following characteristics. Average particle size 18-25μ m, a specific surface area of 2.5 to 3.5 m 2 / g, a particle size of less than 1 μm and a specific surface area of 10 to the whole inorganic powder filler. Molding obtained by compression molding only this inorganic powder filler in a range of 5 to 20% by weight of 20 m 2 / g of inorganic powder filler, and at a pressure at which the average particle size before compression molding is maintained even after compression molding. The volume fraction of the inorganic powder filler in the body is 78 to 90%. The semiconductor device is encapsulated with the encapsulating epoxy resin composition. In the formula, R 1 to R 4 represent hydrogen or an alkyl group, and Gr represents a glycidyl group. Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101112043-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002322345-A |
| priorityDate | 1994-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.