| abstract |
(57) [Summary] [Structure] An alkali-soluble resin composition for an interlayer insulating material, which comprises the following (1), (2), (3) and (4). (1) An acrylic resin and / or a methacrylic resin having a carboxyl group. (2) A polymerizable compound having two or more C = C unsaturated double bonds at the end. (3) A polymerization initiator capable of initiating the polymerization of a C = C unsaturated double bond by heating and / or irradiation with an active energy ray. (4) An inorganic ion exchanger having an -OH group. [Effect] According to the resin composition for an interlayer insulating material of the present invention, since the residual stress due to heating is small, it is possible to manufacture a large-sized inorganic material-based multilayer wiring board, and moreover, hillocks and whiskers due to heating do not occur, which is reliable. Since a multilayer wiring board having high properties can be obtained and the via hole can be easily formed by alkali dissolution, it is of high industrial utility value. |