| abstract |
(57) [Abstract] [Purpose] The container containing the substrate is connected to the processing equipment, Provided is a method of transporting a substrate for a semiconductor device, which transports a substrate from the inside of a container to a processing chamber, in which the substrate for a semiconductor device is transported in a clean environment without polluting the substrate, the pod, or the processing chamber. To do. A structure is provided in which a flow path space 30, 33 surrounded by a door 5 and a lid 8 and a wall surface facing each other can be formed by bringing a pod 1 containing a substrate close to a processing chamber 2. Further, it is mainly configured by a structure having a gas supply means 17 and an exhaust means 22 capable of supplying air to the flow path space by a swirling flow and exhausting the air. [Effect] Since the dirty wall surface can be physically or chemically cleaned independently of the inside of the pod or the processing chamber, it is possible to carry in / out the substrate without contaminating the inside of the substrate, the pod, or the processing chamber. Therefore, a highly reliable and high performance semiconductor device can be manufactured with a high yield. |