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filingDate 1994-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ee6bad5dc0ac5370f12098010cc2fd75
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8598c6feb782af36e4de685ab230c647
publicationDate 1996-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08167770-A
titleOfInvention Method for producing copper-coated polyimide substrate for transfer copper foil
abstract (57) [Abstract] [Purpose] 10 for laminating on polyimide substrate A thin copper foil having a thickness of μm or less can be supplied by a copper-coated polyimide substrate having a polyimide resin as a support, and has heat resistance when laminated with a polyimide-based adhesive, and further, the copper-coated polyimide substrate when laminated. And a copper-coated polyimide substrate in which the adhesion strength at the interface between the copper and the polyimide resin is reduced and the copper foil can be easily transferred to a polyimide base material having an adhesive. [Structure] At least one surface of a polyimide resin is etched with an aqueous solution containing hydrazine hydrate or hydrazine hydrate and an alkali metal hydroxide to impart a catalyst for electroless plating, and nickel or cobalt or an alloy thereof. Film is formed by electroless plating, heat treatment is performed in an inert atmosphere, and then a copper layer is formed by electroless plating or electroplating of copper.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015113494-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100747627-B1
priorityDate 1994-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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