| abstract |
(57) [Summary] [Object] To provide a resin-encapsulated semiconductor device excellent in moldability and moisture resistance reliability. A resin-encapsulated semiconductor device encapsulated with a resin composition containing, as an essential component, an organic phosphorus compound composed of a quaternary phosphonium salt as an epoxy resin, a curing agent, and a curing accelerator. [Effect] It has excellent moldability and moisture resistance reliability, and high mounting reliability and high mounting can be achieved. |