http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08162588-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e35abc32880aa48b0f2c574ff66d21c7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 |
| filingDate | 1994-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fd747229b77e8f0d290410ba635cf5e |
| publicationDate | 1996-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08162588-A |
| titleOfInvention | Lead frame processing method, lead frame, and semiconductor device |
| abstract | (57) [Abstract] [Purpose] When processing a lead frame with multiple pins and a narrow pitch, it is not affected by the dross generated during laser cutting. Further, it is possible to improve the bondability with the terminals of the chip without being affected by heat when the laser light is irradiated. [Structure] Inner tips of inner leads 202 are left uncut, and adjacent leads are connected by a die pad 201, and a support plate 215 is fixed to inner portions of the inner leads 202. Then, laser cutting is performed at the position of the through groove 215A of the support plate 215 to separate the inner leads 202 individually. Further, the plate thickness of the support plate 215 is made thicker than the height of the dross 10 so that the dross 10 is completely accommodated in the through groove 215A. Further, the inner end of the terminal joint portion 202A is arranged outside the position separated from the inner tip of the separated inner lead 202 by at least the width of the heat-affected portion 200a. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013027897-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7732258-B2 |
| priorityDate | 1994-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.