| abstract |
(57) [Abstract] [PROBLEMS] To provide a resin composition which is useful as a solder resist for printed wiring boards and which can be alkali-developed and whose cured product has good alkali resistance, and a crosslinked cured resin thereof. [Structure] 30 to 60 parts by weight of at least one ethylenically unsaturated compound (A) having two or more (meth) acryloyloxy groups in one molecule, and at least an α, β-unsaturated carboxyl group-containing monomer. 15-30% by weight, 40 to 70 parts by weight of a polymer (B) for a binder comprising at least 5 to 30% by weight of a hydroxyl group-containing monomer and 80 to 40% by weight of another copolymerizable monomer, a block type polyisocyanate compound ( C) 1 to 20 parts by weight are blended so that the total of the components (A), (B) and (C) is 100 parts by weight, and the photopolymerization initiator (D ) A cross-linkable curable resin composition containing 0.001 to 10 parts by weight. A method of crosslinking and curing this resin composition by using light irradiation and heat treatment in combination. |