| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a39ca4bbde8931be226e5431d1d1b6af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_46affcd7dcc7417d76477224146f0d9a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02B2075-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F02B75-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
1994-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6a240c287a65b34ddb93fd4a769064c |
| publicationDate |
1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08158057-A |
| titleOfInvention |
Catalytic method in electroless plating |
| abstract |
(57) [Summary] [Object] The present invention does not rely on a sensitizing-activating method or a catalyst-accelerating method, but a catalytic metal that is involved in the adhesion strength of a plating layer or a layer to be plated in an electroless plating method. The purpose is to capture. [Structure] When forming an electroless plating layer on the surface of a non-conductive substance, a treatment comprising at least chitosan or a chitosan derivative on the surface of the non-conductive substance prior to applying a catalyst and each step of electroless plating A liquid is applied to form a hydrophilic coating on the surface. In the hydrophilic coating thus obtained, chitosan chemically adsorbs and captures a catalytic metal such as palladium to immobilize it. As a result, in the electroless plating step, it is possible to obtain a state in which a sufficient amount of the active catalyst is supported on the surface of the material to be plated, and the electroless plating layer with good adhesion can be efficiently formed in a uniform state. To do. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002348673-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003171869-A |
| priorityDate |
1994-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |