http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08157566-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-06 |
| filingDate | 1994-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b50a91c9eeddb59455ae0a4466ebec98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a60ab6107ebd0e18c85adc0a23afaa6a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bcf941f83429056a8152be14b7aaaca |
| publicationDate | 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H08157566-A |
| titleOfInvention | Light / thermosetting undercoat material and method for manufacturing multilayer printed wiring board |
| abstract | (57) [Summary] (Modified) [Structure] 100 parts by weight of epoxy resin, 1 to 30 parts by weight of epoxy resin curing agent, 1 to 100 parts by weight of photocurable resin, And an undercoating agent consisting of 0.01 to 10 parts by weight of a photopolymerization initiator is applied to the inner layer circuit board, and the undercoating agent is tack-free by irradiation with active energy rays, and bisphenol A having a weight average molecular weight of 10,000 or more. A method for producing a multilayer printed wiring board, comprising: laminating a copper foil with an epoxy resin type thermosetting insulating adhesive containing a type epoxy resin on a hard roll, and then integrally curing the same by heating. [Effect] Since the undercoating agent is remelted and the surface is smoothed and the thermosetting insulating adhesive coated on the copper foil maintains its thickness, the plate thickness does not depend on the residual rate of the inner layer copper foil. A multilayer printed wiring board excellent in control can be produced. Furthermore, the undercoating agent and the thermosetting insulating adhesive coated on the copper foil can be integrally molded by heating after laminating and simultaneously performing an integral curing reaction. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6881293-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9716948-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0851726-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003105061-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2376917-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2376917-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6483195-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1553450-A1 |
| priorityDate | 1994-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 107.