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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-19
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363
filingDate 1994-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bdefc98b8b7a3757a0d591ed97eac8c
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publicationDate 1996-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08155677-A
titleOfInvention No-clean flux for soldering
abstract (57) [Summary] [Purpose] To provide a non-cleaning flux for soldering. [Structure] The flux contains an ammonium salt of an organic acid, a cyclic amine compound, a solvent, and a surfactant. Examples of organic acids include adipic acid. An azole compound or a cyclic imide compound can be used as the cyclic amine compound. Solvents include alcohol and water. A nonionic surfactant can be used as the surfactant. A carboxylate is formed from an ammonium salt of an organic acid and a cyclic amine compound. In the soldering temperature range, the carboxylic acid salt dissociates into an amine and an organic acid, and each dissociates continuously to exhibit an activity higher than the single activity. This activity removes the oxide film on the surface of the base material. Since this flux does not contain halogen, it does not need to be cleaned after soldering. For example, when it is applied to the soldering of the leads of a fluorescent display tube, a defective connection between the leads and the socket does not occur without cleaning, and the glass surface of the envelope is not conspicuously contaminated.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004042050-A
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priorityDate 1994-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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