| abstract |
(57) [Abstract] [Purpose] To provide a photosensitive material having various required characteristics as a wiring board. [Structure] A translucent base material, and (1) 10 to 90 parts by weight of rubber laminated on the translucent base material, (2) 5 to 40 parts by weight of a phenol resin, and (3) an epoxy containing a Br-epoxy resin. A photosensitive material containing (4) 0.1 to 10 parts by weight of an epoxy photoinitiator and (5) 0.1 to 10 parts by weight of an aromatic polyazide compound with respect to 10 to 80 parts by weight of a resin and 100 parts by weight of a mixture thereof. A photosensitive element for forming a photo via, which comprises a photosensitive resin composition layer. [Effect] A highly precise pattern can be formed by simple steps such as lamination, exposure and development, and the adhesive strength of copper obtained by electroless plating is sufficiently high, and flame-retardant and highly reliable multilayer printing. Wiring boards can be manufactured. |