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filingDate 1994-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08139443-A
titleOfInvention Printed circuit board and method of manufacturing printed circuit board
abstract (57) [Summary] (Corrected) [Purpose] Using a metal paste containing a specific amount of conductive metal powder and a specific amount of solderability improver on the wall surface of the component insertion hole of the printed circuit board. By applying and hardening the coating to form a metal-containing coating, the component terminal bonding strength is improved. [Structure] After applying a metal paste to the component insertion hole 2 of the printed circuit board, it is heat-cured to form a solderable metal-containing coating 3 on the wall surface of the component insertion hole 2, and the component terminal 6 is placed in the component insertion hole 2. Insert and solder 5 parts.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100965319-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013239565-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009009591-A
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