http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08138969-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-16
filingDate 1994-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e67b03d46c2d77bf7b07830ee2c4f4c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_027428717132e2d0a6412e8d77071c59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f130ea66ca74a2e10fb60da2f46bc934
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aee6b3d6c517c1babe13ce0348ccf2da
publicationDate 1996-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08138969-A
titleOfInvention Electronic component manufacturing method
abstract (57) [Summary] (Modified) [Purpose] To reliably manufacture electronic components with good solderability of external electrodes in the mounting process. [Structure] A conductive paste containing a conductive glass frit is applied to a predetermined position of an electronic component element and baked to form a thick film electrode 5, which is insulated from the conductive glass frit (A) as a conductive paste. Glass frit (B) Is used as a conductive paste containing a glass frit compounded in a weight ratio of A: B = 5: 95 to 100: 0.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010109541-A1
priorityDate 1994-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 30.