| abstract |
(57) [Abstract] [Purpose] Achieves both high impedance and low conductor resistance of multilayer ceramic chip inductors, which are widely used in high-density mounting circuits accompanying the miniaturization and thinning of digital devices such as noise suppression components. In addition, the aim is to improve reliability and reduce costs by reducing the number of layers. [Structure] The wound coil-shaped plated conductors 2 and 5 formed by electroforming are transferred to the sheet-shaped magnetic layers 1 and 6, respectively, and wound through the through holes 4 provided in the sheet-shaped magnetic layer 3. By connecting the spiral coil-shaped plated conductors 2 and 5, low lamination, high impedance and low conductor resistance can be realized at the same time. |