http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0812778-A

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filingDate 1994-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0812778-A
titleOfInvention Method for manufacturing prepreg for laminated board and method for manufacturing laminated board
abstract (57) [Abstract] [Purpose] Sheet-like base material is impregnated with a resin composition of epoxy resin and phenol-added polybutadiene (co) polymer and dried to obtain a laminate having excellent dielectric properties, heat resistance and moisture resistance. When manufacturing a prepreg for the above, the appearance of the manufactured prepreg is made good without foaming. [Structure] A solvent having a boiling point of 100 ° C. ~ 200 ° C, preferably 120 ° C to 160 ° C is used. For example, ethers (n-butyl acetate, acetic acid 2- Either ethylhexyl) or acetic acid esters (ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether), or a mixed solvent of both.
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