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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
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filingDate 1994-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_317ff8a15c44259f5cd7a1e34ecab55e
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publicationDate 1996-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0812741-A
titleOfInvention Liquid epoxy resin composition
abstract (57) [Summary] [Purpose] Low viscosity, good impregnation properties for various parts during use, and excellent heat resistance, voltage resistance, electrical insulation, and humidity resistance without curability deterioration. A liquid epoxy resin composition having mechanical strength and adhesiveness is provided. [Structure] 1,4-parts by weight per 100 parts by weight of epoxy resin Cyclohexanedimethanol diglycidyl ether 50 To 150 parts by weight, 0.8 to 1.1 times equivalent of the acid anhydride type curing agent with respect to the total equivalents of epoxy groups, and 0.1% of curing accelerator. ~ 5 parts by weight.
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