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filingDate 1994-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2454075fc30cb24c52fc62e7883c49f3
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publicationDate 1996-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08125297-A
titleOfInvention Through-hole double-sided board
abstract (57) [Abstract] [Purpose] To prevent the increase of the conductor resistance at the upper and lower edges of the through hole, the defect due to disconnection, the peeling of the conductor, and the leakage of the silicon gel when the protective film of the silicon gel is formed. To aim. [Structure] Through hole 2 penetrating ceramic substrate 1 The through-hole 2 is a double-sided board in which the first conductor 3 formed on the upper surface of the substrate 1 and the second conductor 4 formed on the lower surface of the substrate 1 come into contact with each other via the Is formed in. The bottom of the through hole 2 is opened to the lower surface of the substrate 1 by a small hole 21 having a radius of 0.2 mm or less, and the inclination angle θ of the inner wall surface of the through hole 2 is 35 ° ≦ θ ≦ 5. Set to 5 °.
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Total number of triples: 25.